Your Simple Profit Producers
Made by one
of the first and foremost manufacturers of Wafer biscuit and Ice- cream
cone machines. The
manufacturer combines years of experience with the application of latest
design and technology to meet exacting market demands.
The manufactured equipment ranges from small table top machines to
fully automatic machines.
also designs and supplies tailor made solutions to an individual
"WT" MANUAL CREAM WAFER PLANTS
"WT" Series Cream wafer plants are used for the production of
cream wafer biscuits. They
are characterized by a simple but sturdy mechanism which is flexible
enough to allow for manual operation.
machines are low cost and economical in operation, depending on the output
required, they can be supplied with 6, 9 or 12 Wafer baking tongs.
information details a set of six wafer tongs (6WT) production and
Capacities. The combination
of a Cream spreading table, cutting machine, batter mixer, cream mixer and
packing machine ensure that production is continuous.
are made of special alloy. The
careful selection of a suitable alloy and the casting procedure ensures
dimensional stability, a homogenous and dense surface, thermal stability,
good heat accumulation characteristics and excellent thermal conductivity. Special finishing is applied to ensure the trouble free
release of wafer sheets.
thickness is quickly and easily adjusted by applying spacing shims.
A mixture of
wheat flour, maize (corn) starch, vegetable fat, preservatives, colors
etc. is churned into a paste in the batter mixer. A full recipe for each
type of cone will be provided.
is fed to pre-heated wafer tongs by a special dosing device. Baking takes 1-3* minutes.
The baked sheets are then cooled.
Subsequent operations are creaming, sandwiching & cutting.
The wafers are then packed.
required: Six unskilled workers are required to complete the
area required: The total operational area required is about 750 Sq. Ft.
& Output details: Production
from 100 to 125 kgs* can be made in 8
TURBO BATTER MIXER
( 'TM' SERIES)
output efficient mixers are ideally suited for preparing wafer and ice
cream cone liquid batter.
has an adjustable blade to suit batter preparation from l0 kg. (Lbs) to 50
kg. (125 Lbs) of batter.
beater quickly and thoroughly mixes the ingredients into smooth lump free
The mixer comprises of a vertically mounted electric motor.
The mixing bowl, tank and turbine are all made of Stainless Steel.
SIZE OF THE
BAKING PLATES 270 x 370 mm approx.
No. of Wafer
Tongs "WT" = 6 Nos.
capacity may vary depending on the recipe, batter consistency, cream
For higher capacity please
refer to "Zw/Zwa"
Series Wafer Plant Catalogue.
WAFER CUTTING APPARATUS
cutting machine "WCM"
is manually operated and cuts wafer blocks to small wafer fingers of
predetermined dimensions. The
cutter frame and feed bar can be exchanged to produce other size of
biscuits. This machine is
used for cutting small scale production.
CREAMING APPARATUS (WCR)
It is a
simple stenciling apparatus. The
Sheet holder is designed to hold the sheet in place and allow desired
cream application. A knife is used for depositing a layer of cream for
sandwiching the wafer biscuits.
apparatus can be attended by an unskilled operator.
The above machines are for low scale manual operation.
increase capacity the automatic processing level of cutting and creaming
must be increased. The level
described here is used in the manual process for better quality products.
AUTOMATIC CREAM SPREADING MACHINE
Wafer cream spreading machine can apply any kind of fat cream to the wafer
sheets. The cream is
contact-spread by a rotating roller, whereby the cream on the roller
touches the wafer during the application.
The wafers can be fed to the spreading head either manually or by
the feeder unit.
coating, the wafer sheets are collected into wafer books. The spreading machine is equipped with a calibrated pressing
roller to insure good adhesion between different layers of cream and exact
AUTOMATIC WAFER CUTTING MACHINE
books are fed to the AWC cutter manually.
They are then cut in stacks up to 70 mm high.
The cutter frames and the corresponding pushers are easily
exchangeable to produce other sizes.
Cutting can be individually controlled or the cutter can operate
completely automatically, starting one complete cutting cycle after
finishing the previous one.
cutters can handle wafer books up to 230 x 290 mm.
cutters are designed to cut larger format of 270 x 370 mm.
constantly guided by the principle of offering our customers better and
increased efficiency and higher levels of automation.
technical data and illustrations are subject to change without notice.